MC14 BGA Memory Heatsinks
Price: $16.99
Out of stock
Part Number: MC14
Bulk shipping information: 50 Pcs/Ctn

Product Description

The MC14 now receives an upgraded sticky pad with considerably enhanced adhesion.

The MC14 is a BGA memory Ramsink made of forged copper and optimized for convection cooling. It was designed for cooling of memory components such as those found in graphic cards, but it works equally well with motherboard VRM modules , compositing chips, or any SMC in need of superior cooling.

It is a perfect companion to our VGA liquid cooling solutions thus allowing high-end graphic cards to operate in virtual silence.

Features highlights

  • The MC14 is made of forged copper. The density of the pins has been calculated to offer maximum surface area to increase heat dissipation, while allowing the heated air to circulate freely between the pins.
  • High quality thermal pads: the high quality Thermattach T411 thermal tape offers excellent thermal conductivity and adhesion to the memory modules.
  • Quick, safe and easy installation: simply peel-off the protective paper, and press the Ramsink onto the component to be cooled
  • Ideal companion to the MCW55 GPU water-block
  • Sold in convenenient pack of 8 pieces.
Performance and specifications

Forged C110 copper
14mm (L) x 14mm (W) x 14.5mm (H)
Weight 0.3 oz (8.5 g)
C/W 9.0 (including TIM joint)
Maximum recommended heat load 5 Watts per heatsink

We conducted laboratory tests, comparing the MC14 to generic skived copper units such as shown below, and found a 6 °C improvement in component temperature at a 5 Watts heat load.

Test conditions: 5 W heat load 25 °C ambient OCZ
Junction Temperature 76.8 °C 70.3 °C

For reference, maximum junction (core) temperature in current GDDR3 memory modules is 125 °C (link)

   1. Remove the existing heatsink
   2. Carefully clean the surface of the memory modules with a degreaser (Xylene for example)
   3. follow the easy installation steps below
   4. Handle the heatsinks with care when they have just been installed onto the memory. Heat developped by the memory in operations will strengthen the bond of the thermal adhesive.

Step 1

Step 2

Installation complete

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